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So far cheersonic has created 294 blog entries.

Prospect of SiC Power Module Packaging Technology

Prospect of SiC Power Module Packaging Technology Traditional material processes based on welding and wire bonding have unsolvable problems such as low melting point, high temperature creep failure, wire winding, parasitic parameters, etc. New interconnect materials are developing from welding to crimping and sintering technology. Compared with soldered power modules, the advantages of press-fit modules are as follows. (1) Welding connects the chip and the PCB board through the lead [...]

2023-01-10T07:38:45+00:00

SiC Power Semiconductor

SiC Power Semiconductor In recent decades, power semiconductor devices based on the newly developed third-generation wide bandgap power semiconductor material silicon carbide (SiC) have attracted much attention due to their excellent performance. Compared with the first generation of semiconductor materials silicon (Si), germanium (Ge) and the second generation of semiconductor materials gallium arsenide (GaAs), gallium phosphide (GaP), GaAsAl, GaAsP and other compounds, SiC has wider band gap, stronger high-temperature resistance, [...]

2023-01-10T07:35:48+00:00

The Working Principle and Advantages of Ultrasonic Spraying

The Working Principle and Advantages of Ultrasonic Spraying Ultrasonic spraying, also known as ultrasonic coating, is a spraying process that uses ultrasonic atomization technology. Ultrasonic precision spraying system is a surface precision ultrasonic spraying equipment integrating ultrasonic atomizing nozzle, ultrasonic generator, liquid supply system, motion system, heating system, exhaust system, etc. The sprayed material is first in a liquid state, and the liquid can be a solution, a sol, a [...]

2023-01-10T07:32:22+00:00

Technical characteristics of micromachining process

Technical characteristics of micromachining process Silicon micromachining technology is developed from semiconductor integrated circuit technology. First of all, it draws on the mature microfabrication technology in the integrated circuit process, such as: photolithography, diffusion, ion implantation, epitaxy and film deposition. In addition, after more than 20 years of development, silicon micromachining technology has formed its own characteristics. Unlike the planar technology of integrated circuits, micromachining is basically a bulk processing [...]

2023-01-10T07:28:21+00:00

Ultrasonic Welding Titanium

Ultrasonic Welding Titanium Ultrasonic Welding Titanium - Ultrasonic Soldering Iron - Cheersonic Titanium has a higher yield strength than steel, and its weight is almost half that of steel of the same volume. Although titanium is slightly heavier than aluminum, its yield strength is two times greater than aluminum. The specific strength of titanium is higher than that of aluminum and steel, and the specific modulus is very close to [...]

2023-04-04T08:07:52+00:00

Technical Features of Silicon Micromechanical Sensors

Technical Features of Silicon Micromechanical Sensors Silicon micromechanical sensor is a new type of sensor developed based on silicon micromachining technology. Its main performance characteristics are as follows: 1 Miniaturization and integration Silicon micromechanical sensors use micron-scale micromachining technology to manufacture micron-sized sensor sensitive elements. This kind of device is easy to integrate, so that two-dimensional or three-dimensional sensor arrays can be formed, and integrated large-scale integrated circuit, and the [...]

2023-01-10T07:25:56+00:00

Silicon Micromechanical Sensors

Silicon Micromechanical Sensors With the emergence of silicon micromachining technology, silicon micromechanical sensors have emerged. Compared with classic sensors, this new type of sensor has the advantages of small size, easy integration, low cost, low power consumption, fast speed and high reliability. and high precision. Further integrating this sensor with an integrated circuit can form a powerful smart sensor, and smart sensors are the main direction of sensor technology development [...]

2023-01-10T07:24:27+00:00

Ultrasonic Spray Pyrolysis For Chemical Deposition

Ultrasonic Spray Pyrolysis For Chemical Deposition Ultrasonic Spray Pyrolysis For Chemical Deposition - Cheersonic A coating layer on a substrate, such as a ceramic film (i.e., coating) deposited on a metal or oxide substrate, can be obtained by several methods. The advantages that ultrasonic spray pyrolysis exerts in the art are well known. Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in [...]

2022-12-12T05:49:08+00:00

Porous Materials Welding

Porous Materials Welding Porous Materials Welding - Ultrasonic Soldering Iron - Cheersonic Porous materials are materials with a network structure composed of interconnected or closed pores, with the boundaries or surfaces of the pores composed of pillars or plates. A typical pore structure is a two-dimensional structure formed by the aggregation of a large number of polygonal holes on a plane, which is called a "honeycomb" material due to its [...]

2023-04-04T08:12:33+00:00

Electrochemical Gas Sensor

Electrochemical Gas Sensor Electrochemical Gas Sensor - Multi-Axis Coating Systems - Cheersonic Due to the growing demand for gas detection, such as toxic chemical monitoring in industrial processes, air quality analysis of breathing air, detection of combustible gases in vehicles, and methane detection in mining, the global gas sensor market has been rapidly growing in the forecast period, as well as measuring blood alcohol concentration through breathing samples. According to [...]

2022-12-06T06:53:11+00:00
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