Semiconductor Packaging Semiconductor Packaging - Semiconductor Coating Systems - Cheersonic A wafer that has been processed through the previous processes results in square chips of equal size (also known as "single wafers"). The next thing to do is to get the individual chips by dicing. Freshly cut chips are fragile and cannot exchange electrical signals, and need to be handled separately. This process is encapsulation, which involves forming a protective [...]

Semiconductor Testing Semiconductor Testing - Semiconductor Coating Systems - Cheersonic The main goal of the test is to check whether the quality of the semiconductor chip reaches a certain standard, thereby eliminating defective products and improving the reliability of the chip. In addition, tested defective products do not enter the packaging step, helping to save cost and time. Electronic Die Sorting (EDS) is one test method for wafers. EDS is [...]

Semiconductor Interconnect Semiconductor Interconnect - Semiconductor Coating Systems - Cheersonic The conductivity of semiconductors lies between conductors and nonconductors (i.e. insulators), a property that allows us to fully control the flow of electricity. Components such as transistors can be built through wafer-based lithography, etching and deposition processes, but they also need to be connected to send and receive power and signals. Metals are used for circuit interconnection because of their [...]

Wafer Thin Film Deposition Wafer Thin Film Deposition - Photoresist Coating - Cheersonic To create the tiny devices inside the chip, we need to continuously deposit layers of thin films and etch away the excess, as well as add materials to separate the different devices. Each transistor or memory cell is built step-by-step through the above process. By "thin film" we mean here a "film" that is less than 1 [...]

Wafer Etching Wafer Etching - Polyimide Coatings - Photoresist Coating - Cheersonic After the photolithography of the circuit pattern on the wafer is completed, an etching process is used to remove any excess oxide film and leave only the semiconductor circuit pattern. To do this requires the use of liquid, gas or plasma to remove selected excess. There are two main methods of etching, depending on the substance used: wet [...]

Wafer Lithography Wafer Lithography - Polyimide Coatings - Photoresist Coating - Cheersonic Lithography is the "printing" of a circuit pattern onto a wafer by light, which we can understand as drawing the plan on the surface of the wafer required for semiconductor fabrication. The higher the fineness of the circuit pattern, the higher the integration of the finished chip, which must be achieved through advanced lithography technology. Specifically, photolithography can [...]

Wafer Oxidation Wafer Oxidation - Photoresist Spray System - Cheersonic The role of the oxidation process is to form a protective film on the wafer surface. It protects wafers from chemical impurities, prevents leakage currents from entering circuits, prevents diffusion during ion implantation, and prevents wafer slippage during etching. The first step of the oxidation process is to remove impurities and pollutants, and it is necessary to remove impurities such [...]

Wafer Processing Wafer Processing - Photoresist Deposition System - Cheersonic All semiconductor processes start with a grain of sand! Because the silicon contained in the sand is the raw material needed to produce wafers. Wafers are circular slices formed by cutting a single crystal cylinder of silicon (Si) or gallium arsenide (GaAs). To extract high-purity silicon materials, silica sand, a special material with a silicon dioxide content of up to [...]

Wafer Processing Wafer Processing - Photoresist Deposition System - Cheersonic All semiconductor processes start with a grain of sand! Because the silicon contained in the sand is the raw material needed to produce wafers. Wafers are circular slices formed by cutting a single crystal cylinder of silicon (Si) or gallium arsenide (GaAs). To extract high-purity silicon materials, silica sand, a special material with a silicon dioxide content of up to [...]

Spray Magnetic Ink Spray Magnetic Ink - Ultrasonic Spray - Cheersonic Recently, our company has tested a new project - spraying magnetic ink. The substrate used is a silicone rubber substrate, and the spray system is necessary to create a superhydrophobic surface, and the liquid to be sprayed will be a magnetic ink. Cheersonic focused on the ultrasonic coating technology more than 20 years. We provide not only standard ultrasonic [...]