Ultrasonic-Assisted Brazing Technology for Glass-Metal Bonding In fields such as microelectronics packaging and aerospace, the combination of glass, due to its excellent optical properties and stability, and metal, due to its excellent electrical and thermal conductivity, is crucial for achieving the functionality of high-end devices. However, due to the significant differences in the physical and chemical properties of glass and metal, bonding faces three major challenges: poor wettability, mismatched thermal [...]

Ultrasonic Tinning Technology In the photovoltaic industry, silver consumption is a key concern in achieving 100% renewable energy production. Current bifacial PERC+ solar cells rely on silver for the front-side contact. While aluminum metallization is used on the back side to contact the silicon, the aluminum's natural oxide layer hinders standard soldering, requiring back-side silver pads for interconnection between the cell and copper wires. This results in high silver consumption [...]

Ultrasonic-Assisted Brazing Technology for Copper and Graphite Graphite holds a vital position in numerous industrial sectors due to its high-temperature resistance, high strength, corrosion resistance, and excellent electrical and thermal conductivity. Copper, on the other hand, is a key material in industrial production due to its excellent electrical and thermal conductivity and good processability. The connectors formed by combining the advantages of both materials are widely used in high-end industries [...]

A New Option for Fluxless Precision Soldering A New Option for Fluxless Precision Soldering - Sonic4Lab In the field of precision soldering of electronic components, miniaturization of pad size and refinement of soldering materials are becoming increasingly common. Traditional soldering methods are often limited by issues such as residual flux and insufficient soldering precision. The emergence of ultrasonic soldering irons, leveraging the core advantages of fluxless soldering, provides an efficient [...]

Ultrasonic Brazing Technology for Semiconductor Coolers Ultrasonic Brazing Technology for Semiconductor Coolers - Sonic4Lab Semiconductor TEC coolers, based on the Peltier effect, are components that combine thermoelectric power generation and cooling. They are lightweight, compact, and offer high cooling capacity, making them particularly effective in cooling applications requiring limited space. Simply put, when direct current passes through a galvanic couple formed by two different semiconductor materials connected in series, heat [...]